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KUP TERAZ
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KUP TERAZ
In Stock
KUP TERAZ
In Stock
KUP TERAZ
In Stock
KUP TERAZ
In Stock
KUP TERAZ
In Stock
KUP TERAZ
In Stock
KUP TERAZ
| Differences are marked in red | SPATIUM M470 PRO PCIe 4.0 NVMe M.2 500GB | SPATIUM M470 PRO PCIe 4.0 NVMe M.2 1TB | SPATIUM M470 PRO PCIe 4.0 NVMe M.2 2TB |
|---|---|---|---|
| Model Name | SPATIUM M470 PRO PCIe 4.0 NVMe M.2 | SPATIUM M470 PRO PCIe 4.0 NVMe M.2 | SPATIUM M470 PRO PCIe 4.0 NVMe M.2 |
| Capacity | 500GB | 1TB | 2TB |
| Controller | PHISON E27T / PHISON E33 | PHISON E27T / PHISON E33 | PHISON E27T / PHISON E33 |
| Flash Memory | 3D NAND | 3D NAND | 3D NAND |
| Form Factor | M.2 2280 | M.2 2280 | M.2 2280 |
| Interface | PCIe Gen4 x4, NVMe 1.4 | PCIe Gen4 x4, NVMe 1.4 | PCIe Gen4 x4, NVMe 1.4 |
| Compatibility | PCIe Gen4 / Gen3 / Gen2 / Gen1 | PCIe Gen4 / Gen3 / Gen2 / Gen1 | PCIe Gen4 / Gen3 / Gen2 / Gen1 |
| Dimensions | 80.00mm (L) x 22.00mm (W) x 2.15mm (H) | 80.00mm (L) x 22.00mm (W) x 2.15mm (H) | 80.00mm (L) x 22.00mm (W) x 2.15mm (H) |
| Sequential Read up to (MB/s) | 5500 | 6000 | 6000 |
| Sequential Write up to (MB/s) | 3600 | 4500 | 5000 |
| Random Read 4KB up to (IOPS) | 500,000 | 950,000 | 950,000 |
| Random Write 4KB up to (IOPS) | 900,000 | 950,000 | 950,000 |
| Maximum Operating Power (W) | 4.3 | 4.5 | 4.5 |
| Idle Power PS3 (mW) | 50 | 50 | 50 |
| Low Power L1.2 (mW) | 5 | 5 | 5 |
| Operating Temperatures | 0°C – 70°C | 0°C – 70°C | 0°C – 70°C |
| Storage Temperatures | -40°C – 85°C | -40°C – 85°C | -40°C – 85°C |
| Terabytes Written (TBW) | 160 | 320 | 640 |
| Mean Time Between Failure (MTBF) | Up to 1,500,000 Hours | Up to 1,500,000 Hours | Up to 1,500,000 Hours |
| Limited Warranty | 5 Years, or the coverage for the maximum TBW as stated, whichever comes first. | 5 Years, or the coverage for the maximum TBW as stated, whichever comes first. | 5 Years, or the coverage for the maximum TBW as stated, whichever comes first. |
| Advanced Features | TRIM (Performance Optimization, OS Support required)<br /> SMART (Self-Monitoring, Analysis and Reporting Technology)<br /> LDPC (Low Density Parity Check) ECC Algorithm End to End Data Path Protection<br /> APST (Autonomous Power State Transition)<br /> Pyrite (Encryption, Data Security) | TRIM (Performance Optimization, OS Support required)<br /> SMART (Self-Monitoring, Analysis and Reporting Technology)<br /> LDPC (Low Density Parity Check) ECC Algorithm End to End Data Path Protection<br /> APST (Autonomous Power State Transition)<br /> Pyrite (Encryption, Data Security) | TRIM (Performance Optimization, OS Support required)<br /> SMART (Self-Monitoring, Analysis and Reporting Technology)<br /> LDPC (Low Density Parity Check) ECC Algorithm End to End Data Path Protection<br /> APST (Autonomous Power State Transition)<br /> Pyrite (Encryption, Data Security) |